Foxconn · 1 month ago
Sr. Thermal/Mechanical Field App Engineer
Austin, TX, Austin, TX, US
Full-time
Onsite
Senior Level
5+ years expFoxconn E BG Group is a leading provider of technological solutions and the world’s largest electronics manufacturer. The Sr. Thermal/Mechanical Field Application Engineer serves as a technical lead and trusted advisor for enterprise and OEM customers, focusing on product integration, optimization, and deployment of advanced solutions while collaborating with various internal teams.
Consumer ElectronicsElectronicsHardwareInformation TechnologyManufacturingProduct DesignSoftware
Responsibilities
Serve as the primary technical interface for key customers across the Central and Southwest regions, providing in-depth system design, application guidance, and troubleshooting support
Lead product integration and validation efforts, including hardware and firmware testing, performance analysis, and field optimization
Partner with internal R&D and product management teams to translate customer requirements into design specifications and influence product enhancements
Conduct technical presentations, product demos, and customer training sessions for both engineering and executive audiences
Manage field issue resolution, coordinate root-cause analysis, and communicate corrective actions with internal and external stakeholders
Support business development activities, collaborating with sales teams to identify opportunities, define system solutions, and achieve design wins
Provide ongoing technical consultation and post-deployment support to sustain customer satisfaction and strengthen long-term relationships
Maintain awareness of industry trends, competitor products, and emerging technologies to advise internal teams on strategy and roadmap direction
Document technical findings, lessons learned, and recommendations for process and product improvement
Determine customer requirements (both explicit and implicit) and accurately communicate them back to key engineering team members
Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing)
Work closely with the sales team to understand customer requirements, develop tailored solutions, and assist with formal proposal development and custom product quotes
Oversee multiple customer opportunities while focusing on key priorities
Mentor and coach junior field application engineers as needed
Travel as needed (up to 25–30%) to customer sites and internal meetings, including in the US, Mexico and Asia
Perform other duties as requested or assigned
Qualification
Required
Bachelor's degree in mechanical or Thermal Engineering, or a related field required
Minimum 5+ years of relevant experience in thermal/mechanical field applications engineering
Proven success supporting enterprise, OEM, or technology partners in the design and implementation of complex solutions
Demonstrated ability to work cross-functionally with R&D, product management, and customer engineering teams
Excellent communication and presentation skills with the ability to translate complex technical concepts for diverse audiences
Excellent communication skills, intrapersonal skills, and presentation skills
Strong capability in conveying complex technical concepts to stakeholders at all levels
Excellent problem-solving and analytical skills
Bilingual proficiency in English and Mandarin Chinese required
Preferred
Master's degree preferred
Any liquid cooling solutions experience is preferred
Company
Foxconn
Established in Taiwan in 1974, Hon Hai Technology Group (Foxconn) (2317: Taiwan) is the world’s largest electronics manufacturer.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$5.75BKey Investors
Sprint Vc
2025-10-28Post Ipo Debt· $757.58M
2025-08-07Post Ipo Debt· $3.82B
2024-11-20Post Ipo Debt· $1.1B
Leadership Team
S
Shen Tao-pang
Chief Financial Officer
IC Lin
Senior AVP
Recent News
2026-01-22
2026-01-22
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