Teledyne Scientific & Imaging · 4 weeks ago
Wire Bonding Technician
Teledyne Scientific & Imaging is a leading provider of enabling technologies for industrial growth markets, seeking a Wire Bonding Technician to join their mission-focused team. The role involves performing wire bonding of Focal Plane Arrays and silicon readout devices, inspecting parts, and utilizing an ERP system for data tracking and reporting.
Product ResearchProfessional Services
Responsibilities
Perform wire bonding of Focal Plane Arrays (FPA) and silicon readout devices
Inspect and evaluate parts in accordance with Quality Assurance requirements
Accurately follow established procedures and bonding diagrams
Frequently work with Enterprise Resource Planning (ERP) system for tracking and reporting of data
Qualification
Required
Experience using and setting up manual ball and wedge bonding and automatic wire bonders
Ability to work under a microscope with good hand-eye coordination
Familiarity with electrostatic discharge (ESD) controls
High School Diploma or equivalent with three (3) to five (5) years of experience or associate's degree in a related field with zero (0) to two (2) years of experience
U.S. Citizenship
Benefits
Health, Dental, Vision, and Life Insurance from Day 1
Paid Vacation, Sick Time, and Holidays
401(k) with Company Match
Employee Stock Purchase Plan
Educational Tuition Reimbursement
Fun Employee Events throughout the year
Company
Teledyne Scientific & Imaging
Teledyne Scientific & Imaging provides research and development services in the areas of electronics, imaging sensors. It is a sub-organization of Teledyne Technologies.
Funding
Current Stage
Growth StageRecent News
2025-11-27
2025-11-21
2025-09-17
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