TE Connectivity · 1 month ago
Principal R&D Thermal Product Development Engineer
TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. The Principal R&D Thermal Product Development Engineer will drive new products from concept to high-volume manufacturing, focusing on innovative cooling solutions and addressing technical challenges in the high-speed interconnect industry.
AutomotiveElectrical DistributionHardwareManufacturingSoftware
Responsibilities
Conduct feasibility studies
Perform/direct/support detailed design, prototyping, testing, and manufacturing ramp of new and modified designs
Define material requirements and new or improved manufacturing processes
Assist in the qualification of suppliers for new product
Develop innovative cooling solutions for the high-speed digital interconnect industry
Research and apply emerging technologies to new product development
Analyze electronics cooling problems through robust modeling methods
Address near-adjacent technical challenges such as: Manufacturability, Tolerancing, Structural Integrity, Life Cycle, Cost & Market Acceptance
Help expand global Best Known Methods related to simulation
Present data and ideas in a clear and impactful manner
Interface with engineering teams of various disciplines, including external customers
Qualification
Required
Bachelor's Degree in related field required
10+ years of engineering experience, including 6+ years in the electronics cooling industry
10+ years of thermal modeling with ANSYS Icepak, Fluent, and/or similar CFD tool
3D CAD skills with PTC Creo (ProE) or ANSYS SpaceClaim
Experience with and knowledge of liquid and/or immersion cooling
Self-motivated, efficient, able to work with little or no supervision, and committed to a team approach
Strong interpersonal, organization, and project management skills
Ability to prioritize responsibilities in a fast-paced work environment
Ability to understand and discuss technical engineering issues
Ability to read and understand engineering drawings and specifications
Comfortable interfacing with and presenting to various disciplines
Attention to detail and accuracy
Ability to work on multiple concurrent projects
Preferred
Masters or PhD
Experience in core processes such as stamping, molding, plating, and assembly
Experience with mechanical structural analysis is a plus
Experience in and knowledge of the high-speed digital industry is a plus
Familiarity with standards related to data center cooling (e.g, ASHRAE)
Track record of innovation (patents, publications, etc.)
Benefits
Health insurance
401(k)
Disability
Life insurance
Employee stock purchase plan
Paid time off
Voluntary benefits
Company
TE Connectivity
TE Connectivity provides and markets engineered electronic components, network solutions, and specialty products.
H1B Sponsorship
TE Connectivity has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (85)
2024 (75)
2023 (103)
2022 (93)
2021 (81)
2020 (76)
Funding
Current Stage
Public CompanyTotal Funding
$3.1B2025-04-29Post Ipo Debt· $1.47B
2025-01-28Post Ipo Debt· $782.37M
2024-07-30Post Ipo Debt· $350M
Recent News
2025-11-14
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