Foxconn Industrial Internet - FII · 2 months ago
Product Engineering Manager (Project 9/IB4)
Houston, TX
Contract
Onsite
Senior Level
7+ years expFoxconn Industrial Internet - FII is seeking an experienced Product Engineering Manager to lead the development and continuous improvement of high-performance computing servers. The role involves overseeing the engineering team for product readiness, manufacturability, and cost optimization throughout the product lifecycle.
Consumer Electronics
Responsibilities
Drive the full NPI cycle for HPC servers—from prototype to high-volume ramp across global manufacturing partners
Oversee EVT, DVT, and PVT activities, ensuring validation coverage for compute, storage, networking, power, and thermal domains
Partner with R&D, design engineering, and manufacturing to ensure product readiness, robust documentation, and efficient design transfer
Drive Design for Manufacturability (DFM), Design for Test (DFT), and Design for Assembly (DFA) reviews for all new products
Collaborate with SMT, system integration, mechanical, and test engineering to ensure stable, repeatable server builds
Oversee assembly process definition, fixture/tooling design, functional test strategies, and traceability requirements
Ensure alignment of manufacturing architecture with server performance and reliability goals (power delivery, airflow, component stress profiles, etc.)
Lead root-cause analysis and corrective actions (RCCA) for quality issues, field returns, and product escalations
Manage engineering changes (ECOs), component qualifications, and product revisions
Drive continuous improvement initiatives focused on yield, reliability, cost, and throughput
Provide technical leadership on issues involving:
Lead failure analysis for component, board, and system-level issues across prototypes, ramp, and field returns
Serve as the technical interface between Engineering, Operations, Supply Chain, and Quality
Manage supplier and manufacturing partner technical activities (PCBA, plastics, metals, test houses, etc.)
Provide guidance and mentoring to product engineers and junior engineering staff
Develop and track project schedules, deliverables, and risk mitigation plans
Communicate status, challenges, and technical recommendations to leadership and cross-functional teams
Qualification
Required
7+ years of experience in server, data center hardware, enterprise hardware, or HPC systems manufacturing
Strong understanding of PCBA design/assembly, signal integrity, thermal systems, and complex system integration
Experience with high-speed interfaces (PCIe, DDR, Ethernet 100G/200G/400G, NVMe)
Proven track record leading NPI for compute or enterprise-grade hardware
Strong analytical, problem-solving, and cross-functional leadership skills
Demonstrated experience leading NPI programs or large-scale product releases
Proficiency with engineering documentation and PLM systems (e.g., Agile, Arena, Windchill)
Excellent communication and cross-functional leadership abilities
Preferred
Experience with high-density PCB designs, BGA, fine-pitch components, and high-speed digital or RF products
Experience with GPU/accelerator platforms (NVIDIA, AMD, Intel)
Understanding of BIOS/UEFI, BMC/IPMI/Redfish, and system management controllers
Knowledge of thermal modeling/testing, airflow simulation, and cooling technologies
Familiarity with data center compliance and reliability standards (UL, FCC, CE, NEBS, etc.)
Familiarity with environmental, regulatory, and compliance requirements (UL, CE, RoHS, WEEE, FCC, etc.)
Experience working with Tier-1 ODMs for server manufacturing
Background in working with contract manufacturers (CMs) domestically or internationally
Experience with automated test equipment (ATE) and functional test strategy development
Company
Foxconn Industrial Internet - FII
Hon Hai Precision Industry Co., Ltd., widely known as Foxconn, is a Taiwanese multinational electronics manufacturer and one of the world’s largest contract manufacturers.
501-1000 employees
Funding
Current Stage
Late StageCompany data provided by crunchbase