Micron Technology · 2 months ago
Staff Product Yield Enhancement Engineer, HBM
Boise, ID - Main Site
Full-time
Onsite
Lead/StaffMicron Technology is a world leader in innovating memory and storage solutions. As a Product Yield Enhancement Engineer, you will focus on failure analysis of next-generation High Bandwidth Memory devices to enhance product reliability and support rapid production ramp.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Perform Electrical Failure Analysis and Fault Isolation
Operate uMate and Merlin bench test platforms
Utilize fault isolation methods such as emission, laser techniques, and EOTPR
Operate Hamamatsu iPHEMOS, Thermo Fisher ELITE and Thermo Fisher Meridian
Characterize or model backend test, internal qualification, and RMA fail signatures
Extensive understanding of physical and logical semi-conductor design
Use layout/schematic to aid in fault isolation and fail signature modeling
Understand various PFA and de-processing techniques for failures
Understanding Fabrication Process and Package Assembly
In depth understanding of CMOS process fabrication levels, steps, and methodologies
Knowledge of the steps and details involved in the package assembly flow
Understand reliability concerns that can cause delayed breakdown fail signatures
Extensive expertise with process and assembly related defects as well as their causes and effects
Understand probe, backend test and qualification flows
Communicate effectively with internal and external partners for failure analysis
Generate organized and timely failure analysis reports with clearly communicated causes and effects
Perform fab, probe, and backend data extractions to provide supplemental data
Qualification
Required
Excellent problem-solving and analytical skills
Strong grasp of concepts regarding thorough investigative procedure
Computer aided layout and schematic experience
Semiconductor process coursework and experience
UNIX and programming experience
Experience working in teams and ability to work well with others
Solid GPA
Good communication skills
Perform Electrical Failure Analysis and Fault Isolation
Operate uMate and Merlin bench test platforms
Utilize fault isolation methods such as emission, laser techniques, and EOTPR
Operate Hamamatsu iPHEMOS, Thermo Fisher ELITE and Thermo Fisher Meridian
Characterize or model backend test, internal qualification, and RMA fail signatures
Extensive understanding of physical and logical semi-conductor design
Use layout/schematic to aid in fault isolation and fail signature modeling
Understand various PFA and de-processing techniques for failures
Understanding Fabrication Process and Package Assembly
In depth understanding of CMOS process fabrication levels, steps, and methodologies
Knowledge of the steps and details involved in the package assembly flow
Understand reliability concerns that can cause delayed breakdown fail signatures
Extensive expertise with process and assembly related defects as well as their causes and effects
Understand probe, backend test and qualification flows
Communicate effectively with internal and external partners for failure analysis
Generate organized and timely failure analysis reports with clearly communicated causes and effects
Perform fab, probe, and backend data extractions to provide supplemental data
Preferred
Course work in VLSI design and semiconductor device physics
Benefits
Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
Founded in 1978
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
South China Morning Post
2026-01-22
The Motley Fool
2026-01-22
The Motley Fool
2026-01-22
Company data provided by crunchbase