Broadcom · 6 hours ago
R&D Engineer IC Design
San Jose, CA
Full-time
Onsite
Senior Level
$120K/yr - $192K/yr
6+ years expBroadcom is a leading technology company specializing in developing advanced networking solutions. They are seeking an experienced R&D Engineer to design cutting-edge CoWos 2.5D and 3D interposer designs, collaborating with cross-functional teams to meet the physical requirements of the interposers.
MobileSemiconductorWireless
Responsibilities
Designing interposers starting with custom routing for high speed interfaces, bump map design, routing and physical verification and tapeout to the foundries
Interacting with packaging, signal integrity and foundries to meet the packaging, SI and physical requirements of the interposers
Handling multiple Interposer designs in parallel
Qualification
Required
Experience with interposer and advanced packaging design, including CoWoS, 2.5D/3D
Proficiency with EDA tools such as Cadence (Innovus, Integrity), Synopsys (3DIC compiler), Mentor Graphics (Calibre) for layout generation, editing and verification
Strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies
Basic understanding of high-speed signal integrity (SI), power integrity (PI), and thermal analysis
Familiarity with semiconductor fabrication processes, particularly for silicon interposers
Strong scripting skills (Python, Tcl, SKILL) for automation and flow customization
Ability to work with cross-functional teams including IC design engineers, packaging engineers, and foundries
Strong problem-solving skills and attention to detail
Excellent communication and teamwork skills
Ability to document design processes, specifications, and reviews
Familiarity with 3DBlox interposer modelling language is a plus
Bachelor's in Electrical Engineering, Microelectronics, or related fields and 8+ years of related experience, or a Master's degree and 6+ years of related experience
Preferred
Hands-on experience with high-density interposers in complex packaging environments
Strong scripting skills to automate the interposer design flow
Previous experience at semiconductor or advanced packaging companies
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave
Vacation time
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
10001+ employees
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Greg Singh
CTO for APJ, Enterprise Security Group
Kirsten Spears
CFO and CAO, Broadcom
Recent News
2026-01-01
IEEE Spectrum
2025-12-31
2025-12-30
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