Applied Materials · 2 months ago
Process engineer
Applied Materials is a global leader in materials engineering solutions used to produce advanced chips and displays. They are seeking a highly skilled Process Engineer with experience in photonics and advanced packaging technologies to develop high-performance photonic interconnects and co-packaged optical systems.
ElectronicsManufacturingSemiconductorSoftware
Responsibilities
Design and develop advanced packaging architectures for microLED photonic interconnects and heterogeneous integration
Lead Cu backplane RDL design, layout, fabrication, and integration
Develop mass transfer and die bonding solutions, including thermal compression bonding and hybrid bonding, tailored to system integration requirements
Collaborate with substrate layout, IC design, and module teams to co-optimize packaging, signal integrity, and thermal performance
Perform thermal, mechanical, and optical simulations to validate packaging reliability and performance
Conduct optical, electrical, and tolerance analysis of photonic devices; optimize components for performance, efficiency, reliability, and manufacturability
Qualification
Required
Ph.D. in EE, MSE, Phys, or related discipline (M.S. with relevant experience may be considered)
Proven experience in Cu RDL layout, design, fabrication, and integration
Hands-on expertise in thermal compression bonding and hybrid bonding processes
Experience with Co-Packaged Optics (CPO) and Optical Engine development
Experience working in cleanroom environments and advanced IC fabrication
Proficiency in design layout and simulation software such as Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL and Ansys
Strong problem-solving skills and ability to work in a collaborative research environment
Benefits
Comprehensive benefits package
Participation in a bonus and a stock award program
Company
Applied Materials
Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.
H1B Sponsorship
Applied Materials has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (435)
2024 (465)
2023 (362)
2022 (429)
2021 (456)
2020 (354)
Funding
Current Stage
Public CompanyTotal Funding
$2.1BKey Investors
Stonnington GroupUS Department of Energy
2025-02-24Post Ipo Debt· $2B
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M
Leadership Team
Recent News
2026-01-16
2026-01-16
2026-01-16
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