Product Engineering Intern jobs in United States
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Cadence · 8 hours ago

Product Engineering Intern

positionAustin, TX
timeInternship
remoteOnsite
seniorityIntern

Cadence is a technology company focused on developing leaders and innovators. They are seeking a highly motivated graduate student for an internship in the Product Engineering team, where the intern will work with R&D and Customer Engagement teams to influence the development of software tools for advanced chip design platforms.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Designing, developing, troubleshooting and debugging software programs on Unix/Linux platforms
Supporting Customers in performing successful tapeouts of their System-on-chip designs

Qualification

EDA toolsVLSI designUNIX/LinuxTclAlgorithmic skillsPassion to learnProblem solvingTeam playerCommunication skills

Required

Currently enrolled in BS or MS studies in Computer Science or Electrical Engineering
Experience with EDA tools and with VLSI design; familiar with digital implementation challenges including clock tree synthesis, routing, optimization and silicon signoff
Experience with UNIX and/or LINUX platforms
Strong knowledge of Tcl
Strong analysis and problem solving skills
Excellent algorithmic skills
Team Player
Strong ability and passion to learn
Excellent verbal and written communication skills

Company

Cadence

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Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.
dateFounded in 1988
location
San Jose, California, USA
people-size10001+ employees
web-link
https://www.cadence.com

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (252)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Recent News

EE Times
Cadence’s Conformal AI Studio Redefines Logic Verification for the AI-Driven SoC Era
2025-12-30
eeNews Europe
Cadence tapes out UCIe IP at 64Gbps on TSMC N3P
2025-12-26
GlobeNewswire
Semiconductor IP Market Size to Exceed USD 17.88 Billion by 2033, at 9.77% CAGR | Research by SNS Insider
2025-12-17
Company data provided by crunchbase