Product Marketing Intern (Dynapower) - Summer 2026 jobs in United States
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Sensata Technologies · 14 hours ago

Product Marketing Intern (Dynapower) - Summer 2026

Sensata Technologies is a company that offers unique internship opportunities for students. As a Product Marketing Intern, you will work on projects supporting the Product Marketing team, engage with peers, and participate in learning opportunities while contributing to various marketing responsibilities.

Electrical DistributionHardwareSoftware
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H1B Sponsor Likelynote

Responsibilities

Collaborate with cross-functional teams to support execution of the portfolio strategy for a business unit
Performing market research and competitive analysis related to product markets
Managing digital marketing campaigns and marketing collateral
Participating in new product launch activities and ensuring customers and the worldwide sales force are aware of new product introductions
Drive pricing comparison strategy and assist in annual price update process

Qualification

Market researchDigital marketingProduct launchCross-functional collaborationCommunicationCreativityTeamwork

Required

Must be currently pursuing a undergrad or masters level degree (e.g. MBA) with interest or focus in marketing from an accredited program
U.S. citizen or U.S. permanent resident is NOT required for this position, however proper work authorizations will be required

Benefits

Sign-on bonus
Paid holidays
Sick time
Medical insurance

Company

Sensata Technologies

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Sensata Technologies engages in the design, manufacture, and distribution of sensors and electronic controls.

H1B Sponsorship

Sensata Technologies has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (27)
2024 (27)
2023 (18)
2022 (29)
2021 (18)
2020 (17)

Funding

Current Stage
Public Company
Total Funding
$500M
2024-05-22Post Ipo Debt· $500M
2010-03-11IPO

Leadership Team

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George Verras
Chief Technology Officer, Executive Vice President
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Daniel L. Black
Member Board Of Directors
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Company data provided by crunchbase