Micron Technology · 2 days ago
Intern - Advanced Packaging TD
Boise, ID
Internship
Onsite
InternMicron Technology is a world leader in innovating memory and storage solutions. The Advanced Package TD Process Intern will collaborate with experienced engineers to support the development of advanced interconnect technologies, providing hands-on experience in problem-solving, line monitoring, data analysis, and project management.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Lead problem-solving activities using structured methodologies such as KT (Kepner-Tregoe)
Define and implement Design of Experiments (DoE) for process development
Present findings and collaborate across sites and teams
Support line monitoring through project management and yield improvement initiatives
Develop new line monitoring methods and critical metrics
Qualification
Required
Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026
Excellent data extraction, analysis, and reporting skills (e.g., system analytics, JMP)
Strong collaboration and communication skills across multi-functional teams
Ability to prioritize multiple complex tasks and adapt to changing responsibilities
Tenacity to work under timelines and limited resources
Preferred
Experience with semiconductor process technologies
Familiarity with structured problem-solving and decision-making frameworks
Exposure to experimental design and statistical analysis tools
Interest in advanced packaging and interconnect development
Benefits
Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
Founded in 1978
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2026-01-03
The Independent
2026-01-03
2026-01-03
Company data provided by crunchbase