Micron Technology · 4 months ago
Intern - APTD Process
Micron Technology is a world leader in innovating memory and storage solutions. They are seeking an Advanced Package TD Process Intern to collaborate with experienced engineers in developing interconnect technologies, providing hands-on experience in problem-solving, line monitoring, and project management.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Lead problem-solving activities using structured methodologies such as KT (Kepner-Tregoe)
Define and implement Design of Experiments (DoE) for process development
Present findings and collaborate across sites and teams
Support line monitoring through project management and yield improvement initiatives
Develop new line monitoring methods and critical metrics
Qualification
Required
Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026
Excellent data extraction, analysis, and reporting skills (e.g., system analytics, JMP)
Strong collaboration and communication skills across multi-functional teams
Ability to prioritize multiple complex tasks and adapt to changing responsibilities
Tenacity to work under timelines and limited resources
Preferred
Experience with semiconductor process technologies
Familiarity with structured problem-solving and decision-making frameworks
Exposure to experimental design and statistical analysis tools
Interest in advanced packaging and interconnect development
Benefits
A choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
A robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Recent News
2026-01-19
2026-01-19
Company data provided by crunchbase