CPU Physical Design Pathfinding Engineer jobs in United States
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Qualcomm · 2 weeks ago

CPU Physical Design Pathfinding Engineer

Qualcomm Technologies, Inc. is a leader in semiconductor technology, and they are seeking a CPU Physical Design Pathfinding Engineer to lead the development of next-generation CPUs. The role involves collaborating with cross-functional teams to address physical design challenges and optimize power, area, and performance metrics.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
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Comp. & Benefits
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H1B Sponsor Likelynote

Responsibilities

Collaborate with cross-functional teams (RTL, Physical Design, Circuits, CAD) to address critical physical design challenges in CPU implementations
Develop innovative techniques within Physical Design and optimization space to meet stringent PPA targets
Coordinate with CPU Software, Architecture, and RTL teams to understand various CPU use cases and propose impactful PPA optimizations
Engage with external CAD tool vendors and internal CAD teams to identify and enhance optimization issues related to CPU designs
Partner with all block-level implementation teams to analyze, implement, and improve optimization methods relevant to the designs
Partner with Process, SoC and Post-silicon teams to analyze, improve design implementations

Qualification

SynthesisPlaceRouteTiming/power analysisHigh performance implementationLow power implementationTCL scriptingPython scriptingPerl scriptingCPU PPA optimizationLibrary cells knowledgeData analytical skillsDeep submicron technologyPre-post silicon correlationIndustry-standard tools

Required

Experience with Synthesis, place and route and signoff timing/power analysis
Knowledge of high performance and low power implementation techniques
Proficiency in scripting (TCL, Python, Perl)
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 8+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field and 7+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience
PhD in Electrical Engineering, Computer Engineering, Computer Science, or related field and 6+ years of Hardware Engineering, Software Engineering, Electrical Engineering, Systems Engineering, or related work experience

Preferred

MS degree in Electrical Engineering with 14+ years of practical experience
Preference for experience in deep submicron process technology nodes
Experience in CPU PPA optimization is advantageous
Knowledge of library cells and optimizations
Solid understanding of industry-standard tools for synthesis, place & route, and tapeout flows
Strong data analytical skills to identify and address physical design issues
Experience in pre-post silicon correlation

Benefits

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package

Company

Qualcomm

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Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

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Cristiano Amon
President & CEO
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Isaac Eteminan
CEO
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Company data provided by crunchbase