Founder, CEO & CTO

Musk reorganises xAI after SpaceX merger and ahead of blockbuster IPO

Elon Musk's AI chatbot Grok gains US market share amid sexualised images backlash, data shows

SpaceX launches 600th Falcon 9 rocket to date with Starlink flight from Vandenberg

Anthropic hits $380 bn valuation

0.875 Principal IC Packaging Test Engineer, Silicon Technology

SpaceX is actively developing technologies to enable human life on Mars, and they are seeking a Principal IC Packaging Test Engineer for their Starlink project. This role involves owning the electrical test equipment definition and developing automated test solutions for semiconductor packaging and wafer testing.

Principal IC Packaging Test Engineer, Silicon Technology (Starlink)

0.75 IC Packaging Test Engineer, Silicon Technology

SpaceX is actively developing technologies to enable human life on Mars, and they are seeking an IC Packaging Test Engineer for their Starlink project. The role involves developing and releasing production test solutions for integrated circuit packaging and assembly, with a focus on semiconductor packaging and wafer test.

IC Packaging Test Engineer, Silicon Technology (Starlink)

0.375 IC Packaging Automation Engineer, Software (Starlink)

SpaceX is a company focused on enabling human life on Mars through advanced technology. They are seeking an IC Packaging Automation Engineer to develop and commission production packaging automation solutions for their Starlink project, which aims to provide fast internet globally.

0.25 IC Package Engineer (Starlink/Akoustis)

SpaceX is a company focused on enabling human life on Mars through advanced technologies. They are seeking an IC Package Engineer to lead the development and implementation of integrated circuit packaging solutions, ensuring high reliability and performance for cutting-edge electronics.

IC Packaging Automation Engineer, Electrical

SpaceX is actively developing technologies to enable human life on Mars and is looking for an IC Packaging Automation Engineer for its Starlink project. The role involves designing and managing automation projects for semiconductor packaging, ensuring compliance with safety regulations, and collaborating with various teams to enhance production efficiency.

IC Packaging Automation Engineer, Electrical (Starlink)

Sr. Human Resources Business Partner

Optical Ceramics Market predicted to reach $603.4 million by 2030 | Current Trend and Future Growth Scenario

Principal Silicon Photonics Packaging Engineer

II-VI Aerospace & Defense is a global leader in lasers, engineered materials and networking components. They are seeking a Principal Silicon Photonics Packaging Engineer to drive product packaging activities from initial concept to production, collaborate with cross-functional teams, and lead optical package development to ensure manufacturability and reliability.

Chief Technology Officer

Networking Segment CTO

Coherent Expands WaveShaper Portfolio With the New 1000A Sharp High-Resolution Programmable Optical Filter

Laser Cladding Market Size to Exceed USD 1570.45 Million by 2033 | Report by SNS Insider

HyperSpectral Raises $7M in Oversubscribed Series A-2 Round to Accelerate Growth

Key facts: JPMorgan Chase (JPM) achieved a new 52-week high of $317.81, accompanied by a trading volume of 7,255,948 shares.

Coherent Corp. is a global leader in lasers, engineered materials, and networking components, seeking a Principal Silicon Photonics Packaging Engineer. The role involves driving product packaging activities from concept to production, developing co-design processes, and collaborating with cross-functional teams to ensure manufacturability and reliability of optical packages.

President & CEO

Startup hub Station F enlists corporates for European AI programme

No cell service? No problem. San Diego tech helps cars communicate

Infinix Upgrades Note 60 Series with Qualcomm Snapdragon Chipsets

Software Defined Vehicle Market to Hit USD 1,902.9 Billion by 2034, at 22.6% CAGR - Says Allied Market Research

Principal IC Packaging Engineer

Qualcomm Technologies, Inc. is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit packaging technologies. This role focuses on spearheading new product introductions for cutting-edge package technologies, particularly targeting Data Center AI, Power Management, and emerging markets.

Chairman and CEO

SVP & CTO, Optical Engineering

Marvell Technology Completes XConn Acquisition

Retimer Market Projected to Reach USD 4.2 Billion by 2035, With 18% CAGR | Transparency Market Research, Inc.

Marvell Closes Celestial AI Acquisition, Contribution To Begin In 2028

Marvell Completes Acquisition of Celestial AI

Advanced Package Technology Principal Engineer

Marvell Technology is a leader in semiconductor solutions that drive data infrastructure. They are seeking an Advanced Package Technology Principal Engineer to own the packaging technology roadmap for AI and networking solutions, define system-level package architecture, and lead co-design efforts across various teams.

Principal Ic Packaging Test Engineer, Silicon Technology (starlink)

Principal Ic Packaging Test Engineer, Silicon Technology (starlink) in united states (1000+)

Principal IC Packaging Test Engineer, Silicon Technology (Starlink)

IC Packaging Test Engineer, Silicon Technology (Starlink)

IC Packaging Automation Engineer, Software (Starlink)

IC Package Engineer (Starlink/Akoustis)

IC Packaging Automation Engineer, Electrical (Starlink)

Principal Silicon Photonics Packaging Engineer

Principal Silicon Photonics Packaging Engineer

Principal IC Packaging Engineer

Advanced Package Technology Principal Engineer