Principal Engineer Silicon Packaging Architect in united states (1000+)

United States

Company

Experience Level

Job Type

Work Model

Date Posted

1 month ago
Principal Engineer - Silicon Packaging Architect
Intel Corporation
/
Late Stage
US, California, Santa Clara
Full-time
$215K/yr - $303K/yr
Hybrid
Lead/Staff
10+ years exp
40 applicants


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Growth Opportunities
H1B Sponsor Likely

6 days ago
Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
SpaceX
/
Aviation & Aerospace · Late Stage
Bastrop, TX
Full-time
Onsite
Lead/Staff
15+ years exp
69 applicants


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Growth Opportunities
No H1B

3 days agoBe an early applicant
Principal Silicon Photonics Packaging Engineer
Coherent Corp.
/
Semiconductors · Public
Fremont, CA
Full-time
$114K/yr - $223K/yr
Onsite
Senior Level, Lead/Staff
4+ years exp
Less than 25 applicants


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H1B Sponsor Likely

4 days agoBe an early applicant
Silicon Packaging Architect / Engineer
Intel Corporation
/
Late Stage
US, Oregon, Hillsboro
Full-time
$122K/yr - $232K/yr
Onsite
Mid, Senior Level
4+ years exp
Less than 25 applicants


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Growth Opportunities
No H1B

13 hours ago
Substrate IC Package Layout Design Engineer
Etched
/
Computer Hardware · Growth Stage
San Jose, CA
Full-time
$150K/yr - $275K/yr
Onsite
Senior Level, Lead/Staff
10+ years exp
102 applicants


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H1B Sponsor Likely

1 day ago
Litho Principal Process Engineering (Silicon Photonics)
GlobalFoundries
/
Semiconductors · Public
Malta, NY
Full-time
$85K/yr - $146K/yr
Onsite
Senior Level, Lead/Staff
4+ years exp
185 applicants


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H1B Sponsor Likely

1 day ago
R&D Packaging Engineer 2
Cook Medical
/
Medical Device · Late Stage
Bloomington, IN
Full-time
Onsite
Mid Level
3+ years exp
73 applicants


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H1B Sponsor Likely

1 day ago
Engineering Manager - Packaging Integration
The Haskell Company
/
Construction · Late Stage
Frisco, TX
Full-time
$125K/yr - $210K/yr
Onsite
Senior Level, Lead/Staff
10+ years exp
47 applicants


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H1B Sponsor Likely

1 day ago
Package Design Engineer
Google
/
Computer Software · Public
Sunnyvale, CA
Full-time
$156K/yr - $229K/yr
Onsite
Mid, Senior Level
4+ years exp
66 applicants


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Growth Opportunities
H1B Sponsor Likely

1 day ago
Senior Packaging Engineer
Nestlé Purina North America
/
Consumer Goods · Late Stage
St Louis, MO
Full-time
$100K/yr - $130K/yr
Onsite
Mid, Senior Level
5+ years exp
45 applicants


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No H1B

1 day ago
Packaging Engineer (Industrial Solutions)
BorgWarner
/
Automotive · Public
Arden, NC
Full-time
$79K/yr - $108K/yr
Onsite
Mid Level
4+ years exp
46 applicants


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H1B Sponsor Likely

1 month ago
Principal IC Packaging Engineer
Qualcomm
/
Semiconductors · Public
San Diego, California, United States of America
Full-time
$202K/yr - $302K/yr
Onsite
Senior Level, Lead/Staff
6+ years exp
58 applicants


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Comp. & Benefits
H1B Sponsor Likely

1 month ago
Silicon Packaging Layout Engineer
Celestial AI
/
Growth Stage
Santa Clara, CA
Full-time
$165K/yr - $215K/yr
Onsite
Mid Level
4+ years exp
51 applicants


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H1B Sponsor Likely

2 days ago
Photonics Packaging Engineer II
Jabil
/
Electrical & Electronic Manufacturing · Public
United States
Full-time
$66K/yr - $118K/yr
Remote
Entry, Mid Level
2+ years exp
46 applicants


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H1B Sponsor Likely

1 month ago
Silicon Photonics Packaging Technical Leader (HYBRID) 2000935
Cisco
/
Computer Software · Public
San Jose, California, US
Full-time
$169K/yr - $241K/yr
Hybrid
Senior Level
7+ years exp
26 applicants


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Growth Opportunities
H1B Sponsor Likely

2 months ago
Principal Optoelectronic Packaging Engineer
Samtec Inc
/
Electrical & Electronic Manufacturing · Late Stage
San Diego, CA
Full-time
$187K/yr - $212K/yr
Onsite
Lead/Staff
15+ years exp
Less than 25 applicants


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H1B Sponsor Likely

1 month ago
Senior Photonic Packaging Design Engineer
Taara
/
Telecommunications · Growth Stage
Sunnyvale, CA
Full-time
$220K/yr - $270K/yr
Onsite
Senior Level
5+ years exp
33 applicants


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H1B Sponsor Likely

4 months ago
Semiconductor Packaging Engineer
Atomic Semi
/
Semiconductors · Growth Stage
San Francisco Office
Full-time
$115K/yr - $180K/yr
Onsite
Entry, Mid Level
2+ years exp
28 applicants


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H1B Sponsored

1 month ago
Advanced Packaging, SI/PI Principal Engineer
Marvell Technology
/
Semiconductors · Public
Boise, ID
Full-time
$148K/yr - $220K/yr
Onsite
Lead/Staff
8+ years exp
Less than 25 applicants


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Growth Opportunities
H1B Sponsor Likely

2 days ago
Principal Engineer Packaging Development R2
Labelmaster
/
Transportation/Trucking/Railroad · Growth Stage
United States
Full-time
$145K/yr - $155K/yr
Remote
Senior Level, Lead/Staff
6+ years exp
85 applicants


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