Advanced Packaging Process Integration Engineer in united states (1000+)

Recommended

United States

Company

Experience Level

Job Type

Work Model

Date Posted

All Filters

6 hours ago
Advanced Packaging Process Integration Engineer
GlobalFoundries
/
Semiconductor · Electronics · Public
Essex Junction
Full-time
$143K/yr - $247K/yr
Onsite
Senior Level, Lead/Staff
15+ years exp
54 applicants


ASK ORION
APPLY NOW


MATCH SCORE
No H1B

9 hours ago
Advanced Packaging Process Engineer, Silicon Technology (Starlink)
SpaceX
/
Aerospace · Manufacturing · Late Stage
Bastrop, TX
Full-time
Onsite
Entry, Mid Level
1+ years exp
40 applicants


ASK ORION
APPLY NOW


MATCH SCORE
Growth Opportunities
No H1B

1 day agoBe an early applicant
Packaging Design Engineer - Advanced Wafer-Level & OSAT Processes
nEye.ai
/
Semiconductor · Industrial · Growth Stage
Santa Clara, CA
Full-time
Onsite
Senior Level
5+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

2 days agoBe an early applicant
Advanced Packaging Microelectronics Integration Engineer
SkyWater Technology
/
Aerospace · Industrial · Public
Kissimmee, FL
Full-time
$159K/yr - $238K/yr
Onsite
Senior Level, Lead/Staff
10+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
No H1B

2 days ago
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging
ASM
/
Semiconductor · Electronics · Public
US > Arizona > Phoenix
Full-time
Onsite
Senior Level, Lead/Staff, Director/Executive
10+ years exp
81 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

1 week ago
Advanced Packaging Integration Engineer
Applied Materials
/
Semiconductor · Electronics · Public
Santa Clara, CA
Full-time
$176K/yr - $242K/yr
Onsite
Senior Level
34 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

1 month ago
Process Engineer Intern (Mitsubishi Chemical Advanced Materials)
Mitsubishi Chemical America
/
3D Printing · Industrial · Late Stage
Reading, PA
Internship
Onsite
Intern
200+ applicants


ASK ORION
APPLY NOW


MATCH SCORE
No H1B

3 months ago
Advanced Packaging Engineer – Design & Signal Integrity
Delos Data
/
Semiconductors · Early Stage
United States
Full-time
$160K/yr - $220K/yr
Remote
Mid, Senior Level
67 applicants


ASK ORION
APPLY NOW


MATCH SCORE

1 week ago
Principal Wet Process Engineer, Advanced Packaging
Micron Technology
/
Semiconductor · Electronics · Public
Boise, ID - Main Site
Full-time
Onsite
Senior Level, Lead/Staff
7+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

3 weeks ago
(Senior) Principal Engineer (Process and Hardware), Advanced Packaging
ASM
/
Semiconductor · Electronics · Public
US > Arizona > Phoenix
Full-time
Onsite
Senior Level, Lead/Staff
10+ years exp
80 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

1 week ago
Advanced Packaging Process Development Engineer - Principal
SkyWater Technology
/
Aerospace · Industrial · Public
Kissimmee, FL
Full-time
$137K/yr - $205K/yr
Onsite
Lead/Staff
10+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
No H1B

6 days agoBe an early applicant
Advanced Packaging Engineer – Design & Signal Integrity
Delos Data
/
Semiconductors · Early Stage
Palo Alto, CA
Full-time
$160K/yr - $220K/yr
Hybrid
Mid, Senior Level
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE

1 week ago
Advanced Packaging Integration Engineer
Applied Materials
/
Semiconductor · Electronics · Public
Albany, NY
Full-time
$128K/yr - $176K/yr
Onsite
Mid Level
3+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

1 week ago
Advanced Packaging Process Development Engineer - Staff
SkyWater Technology
/
Aerospace · Industrial · Public
200 NeoCity Wy, Kissimmee, FL 34744, USA
Full-time
$95K/yr - $143K/yr
Onsite
Senior Level, Lead/Staff
5+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
No H1B

2 weeks ago
(Senior) Principal Engineer (Process and Hardware), Advanced Packaging
ASM
/
Semiconductor · Electronics · Public
Greater Phoenix Area
Full-time
Onsite
Senior Level, Lead/Staff
10+ years exp
64 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

2 weeks ago
Advanced Packaging Integration Engineer
Applied Materials
/
Semiconductor · Electronics · Public
Santa Clara, CA
Full-time
$138K/yr - $190K/yr
Onsite
Senior Level
66 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

1 week ago
Advanced Packaging Process Development Engineer - New College Graduate
SkyWater Technology
/
Aerospace · Industrial · Public
Kissimmee, FL
Full-time
$69K/yr - $104K/yr
Onsite
New Grad, Entry Level
0+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
No H1B

1 week ago
(Senior) Member of Technical Staff / Director, Process Engineering, Advanced Packaging
ASM
/
Semiconductor · Electronics · Public
Greater Phoenix Area
Full-time
Onsite
Senior Level, Lead/Staff, Director/Executive
10+ years exp
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely

43 minutes agoBe an early applicant
Packaging Operator 2nd Shift
Young Innovations
/
Healthcare · Marketing · Public
Earth City, MO
Full-time
Onsite
New Grad, Entry Level
Less than 25 applicants


ASK ORION
APPLY NOW


MATCH SCORE

2 hours ago
Packaging Engineer
Nexthop AI
/
Artificial Intelligence (AI) · Cloud Computing · Growth Stage
Santa Clara, California, United States
Full-time
Hybrid
Entry, Mid Level
2+ years exp
28 applicants


ASK ORION
APPLY NOW


MATCH SCORE
H1B Sponsor Likely