Advanced Lead – Sic Gan Power Module Packaging Engineer in united states (1000+)
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6 days agoBe an early applicant
Advanced Lead – SiC/GaN Power Module Packaging Engineer
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AMD
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1 week ago
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Eaton
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TotalEnergies
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Apple
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Texas Instruments
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Semiconductor · Electronics · Public
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Eliyan Corporation
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Semiconductor · Electronics · Growth Stage
73 applicants
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Tesla
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Fermi America
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Artificial Intelligence (AI) · Cloud Computing · Public
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Advanced Microdevices Pvt. Ltd. (India)
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Biotechnology · Industrial · Late Stage
185 applicants
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General Motors
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Electric Vehicle · Transportation · Public
Less than 25 applicants
1 week ago
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SpaceX
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31 applicants
No H1B
1 week ago
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GlobalFoundries
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Eaton
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Electric Vehicle · Late Stage
119 applicants
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1 week ago
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Marvell Technology
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Telecom & Communications · Semiconductor · Public
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